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Press Release

Avicena demonstrates record-breaking ultra-low-energy optical chip-to-chip interconnect Avicena partners with Lumileds to demonstrate microLED-based LightBundleTM chip-to-chip interconnects with superior energy efficiency and bandwidth density. SAN DIEGO, CA — March 7, 2022 — AvicenaTech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the Optical Fiber Communications […]

Press Release

Avicena will showcase its multi-Tbps LED-based optical link for chip-to-chip communication at ECOC 2021 Highly parallel optical links with power efficiency of 0.1pJ/bit, and bandwidth density of 10Tbps/mm2 promise to smash current interconnect bottlenecks in distributed compute systems MOUNTAIN VIEW, CA and BORDEAUX, FRANCE — September 13, 2021 —  Avicena Tech Corp., a privately held […]

LIGHTWAVE Online: June 17, 2021

Avicena touts LED-based LightBundle optical interconnects for chip-to-chip communication The company’s LightBundle leverages microLED light sources and multicore fibers to create highly parallel interconnects that Avicena sources say can enable chip-to-chip communications at distances up to 10 m AUTHOR: Stephen Hardy Mountain View, CA, based startup Avicena Inc. has announced an optical interconnect based on […]

Press Release

Avicena unveils LightBundleTM, a chip interconnect technology with dramatically lower power consumption and higher bandwidth density Highly parallel optical links with power efficiency of 0.1pJ/bit, bandwidth density of 10Tbps/mm2 and reach of up to 10m promise to smash current interconnect bottlenecks in distributed compute systems MOUNTAIN VIEW, CA — June 8, 2021 — Avicena Inc., […]

Avicena at OFC 2021 Rump Session

OFC 2021 Rump Session, Wednesday, 09 June 06:00 – 08:00 am PDT Did the Optics Industry Blunder by Switching Intra-Datacenter Links from NRZ to PAM4? Will More DSP like PAM6 and Coherent Follow, or Will WDM and Parallel Save the Day? Session Organizer and WDM Team Captain:  Chris Cole, II-VI Incorporated, USA WDM Team Provocateurs: […]

Compound Semiconductor: June 2021

Easing the chip-to-chip communication bottleneck by leveraging microLED display technology High-speed optical emitters derived from GaN-based microLED displays can move data at much higher density and lower power than copper, bringing optical connections to the centimetre scale BY BARDIA PEZESHKI, ROB KALMAN, ALEX TSELIKOV AND CAMERON DANESH FROM AVICENA MOST OF THE ENERGY consumed in […]