Press Release

Avicena demonstrates record-breaking ultra-low-energy optical chip-to-chip interconnect

Avicena partners with Lumileds to demonstrate microLED-based LightBundleTM chip-to-chip interconnects with superior energy efficiency and bandwidth density.

Avicena XFAB Wafer with transferred LEDs in wafer-level testing.

SAN DIEGO, CA — March 7, 2022 — AvicenaTech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the Optical Fiber Communications (OFC) Conference in San Diego, CA. Interconnects have become the key bottleneck in modern compute and networking systems. Highly variable workloads are driving the evolution of densely interconnected, heterogeneous, software-defined clusters of XPUs, hardware accelerators, and high-performance shared memory. Exploding Artificial Intelligence (AI)/Machine Learning (ML) and High-Performance Computing (HPC) workloads are accelerating the need for interconnects with ultra-low power consumption, ultra-high bandwidth density, and low latency.

Avicena’s demonstration of record low power consumption with its LightBundleTM interconnect technology is proof of the advances Lumileds has made in microLEDs. We are looking forward to enabling vastly lower power in data center interconnects. — Willem Sillevis-Smitt, Head of Marketing at Lumileds

“We have already demonstrated LightBundleTM links at less than 2pJ/bit using our LightBundleTM technology,” says Bardia Pezeshki, founder and CEO of Avicena, “and will soon demonstrate sub-1pJ/bit links.” LightBundleTM is based on arrays of innovative GaN micro-emitters that leverage the microLED display ecosystem and can be integrated onto high performance CMOS ICs. Avicena is working with Lumileds, one of the world’s top GaN LED innovators, to rapidly ramp production of highly optimized microLED arrays.

“Avicena’s demonstration of record low power consumption with its LightBundleTM interconnect technology is proof of the advances Lumileds has made in microLEDs,” says Willem Sillevis-Smitt, Head of Marketing at Lumileds. “We are looking forward to enabling vastly lower power in data center interconnects.”

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Press Release

Avicena will showcase its multi-Tbps LED-based optical link for chip-to-chip communication at ECOC 2021

Highly parallel optical links with power efficiency of 0.1pJ/bit, and bandwidth density of 10Tbps/mm2 promise to smash current interconnect bottlenecks in distributed compute systems

LightBundle LED-based interconnects for chip-to-chip communication

MOUNTAIN VIEW, CA and BORDEAUX, FRANCE — September 13, 2021 —  Avicena Tech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps LED-based chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2021 in Bordeaux, France  (https://www.ecocexhibition.com/).

The Avicena LightBundleTM achieves order-of-magnitude improvements in power dissipation and density over any other interconnect technology up to a reach of 10 meters. LightBundleTM is purpose-built for multi-Tbps chip-to-chip interconnects in distributed computing, processor-to-memory disaggregation, and other advanced computing applications. LightBundleTM is based on arrays of novel GaN high-speed micro-emitters that leverage the microLED display manufacturing ecosystem and is fully compatible with high performance CMOS ICs.

Interconnects are becoming the key bottleneck in modern compute and network systems. Highly variable workloads are driving the evolution of densely interconnected, heterogeneous, software-defined clusters of CPUs, Graphical Processing Units (GPUs), Data Processing Units (DPUs) and shared memory blocks. Exploding Artificial Intelligence (AI) and Machine Learning (ML) workloads are exemplary of emerging applications driving an accelerating need for interconnects with extremely high density, low power consumption and low latency.

“The cloud and high-performance computing market is looking for a new class of energy efficient high bandwidth density interconnects,” said Vladimir Kozlov, Founder and CEO of LightCounting. “Avicena’s technology has the potential to deliver a paradigm shift in terms of power efficiency, bandwidth density, and reach.”

The cloud and high-performance computing market is looking for a new class of energy efficient high bandwidth density interconnects. Avicena’s technology has the potential to deliver a paradigm shift in terms of power efficiency, bandwidth density, and reach. — Vladimir Kozlov, Founder and CEO of LightCounting

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Press Release

Avicena unveils LightBundleTM, a chip interconnect technology with dramatically lower power consumption and higher bandwidth density

Highly parallel optical links with power efficiency of 0.1pJ/bit, bandwidth density of 10Tbps/mm2 and reach of up to 10m promise to smash current interconnect bottlenecks in distributed compute systems

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MOUNTAIN VIEW, CA — June 8, 2021 —

Avicena Inc., a privately held company in Mountain View, CA, today unveils LightBundleTM, a highly parallel optical interconnect technology targeting up to 10 meters reach for chip-to-chip interconnects in distributed computing, processor-to-memory disaggregation, and other advanced computing applications. LightBundleTM is based on arrays of novel GaN high-speed micro-emitters, leveraging the microLED display manufacturing ecosystem, and is fully compatible with high performance silicon ICs.

Interconnects are becoming the key bottleneck in compute and network systems. Highly variable workloads are driving the evolution of densely interconnected, heterogeneous, software-defined clusters of CPUs, Graphical Processing Units (GPUs), Data Processing Units (DPUs) and shared memory blocks. Exploding Artificial Intelligence (AI) and Machine Learning (ML) workloads are exemplary of emerging applications driving an accelerating need for interconnects with extremely high density, low power consumption and low latency.

We have developed very high-performance optical transmitters based on emitter technology from the display industry. These innovative devices would have been impractical just a few years ago. Our optimized devices and materials support 10Gbps links per lane over -40°C to +150°C temperature with excellent reliability. — Bardia Pezeshki, Founder & C.E.O.

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