Avicena demonstrates record-breaking ultra-low-energy optical chip-to-chip interconnect
Avicena partners with Lumileds to demonstrate microLED-based LightBundleTM chip-to-chip interconnects with superior energy efficiency and bandwidth density.
SAN DIEGO, CA — March 7, 2022 — AvicenaTech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the Optical Fiber Communications (OFC) Conference in San Diego, CA. Interconnects have become the key bottleneck in modern compute and networking systems. Highly variable workloads are driving the evolution of densely interconnected, heterogeneous, software-defined clusters of XPUs, hardware accelerators, and high-performance shared memory. Exploding Artificial Intelligence (AI)/Machine Learning (ML) and High-Performance Computing (HPC) workloads are accelerating the need for interconnects with ultra-low power consumption, ultra-high bandwidth density, and low latency.
Avicena’s demonstration of record low power consumption with its LightBundleTM interconnect technology is proof of the advances Lumileds has made in microLEDs. We are looking forward to enabling vastly lower power in data center interconnects. — Willem Sillevis-Smitt, Head of Marketing at Lumileds
“We have already demonstrated LightBundleTM links at less than 2pJ/bit using our LightBundleTM technology,” says Bardia Pezeshki, founder and CEO of Avicena, “and will soon demonstrate sub-1pJ/bit links.” LightBundleTM is based on arrays of innovative GaN micro-emitters that leverage the microLED display ecosystem and can be integrated onto high performance CMOS ICs. Avicena is working with Lumileds, one of the world’s top GaN LED innovators, to rapidly ramp production of highly optimized microLED arrays.
“Avicena’s demonstration of record low power consumption with its LightBundleTM interconnect technology is proof of the advances Lumileds has made in microLEDs,” says Willem Sillevis-Smitt, Head of Marketing at Lumileds. “We are looking forward to enabling vastly lower power in data center interconnects.”