The Challenge
High-performance compute and networking systems require increasingly distributed architectures but are limited by the shortcomings of conventional electrical and optical interconnects.
SEP 12 – SEP 16, 2021
Stand # 916
BORDEAUX, FRANCE
Dr. Bardia Pezeshki will give a talk at ECOC on Wednesday, Sept 15th, 2021 @ 10:15 AM:
8x2Gb/s LED-Based Optical Link at 420nm for Chip-to-Chip Applications
Dr. Chris Pfistner will be speaking in the Market Focus Panel on Monday, Sept 13th, 2021 @ 1:55 PM:
Novel LED based parallel optical interconnects with 10Tbps/mm2 @ < 0.5pJ/bit for chip-to-chip communication
OCT 12 – OCT 14, 2021
SAN DIEGO, CA
Dr. Bardia Pezeshki will give a talk at the Special Invited Session on Optical Co-Packaging on Wednesday, Oct. 13th, 2021 @ 1:00 PM.
NOV 8 – NOV 10, 2021
SAN JOSE, CA
Dr. Rob Kalman will be speaking at the Future Technology Session on Monday, Nov 8th, 2021:
Wide and parallel LED-based optical links using multi-core fiber for chip-to-chip communications
Dr. Bardia Pezeshki will be speaking in the Optical I/O and Chiplet Ecosystem Panel on Tuesday, Nov 9th, 2021:
LED based optical interconnects with 10Tbps/mm2 @ < 0.5pJ/bit for chip-to-chip communications
JAN 22 – JAN 27, 2022
SAN FRANCISCO, CA
Dr. Bardia Pezeshki will give a talk at SPIE Photonics West on:
Micro-LED-array based optical links using multi-core fiber for chip-to-chip communications
MAR 6 – MAR 10, 2022
SAN DIEGO, CA
Booth #3351
Session Time: March 9, 2022 from 8 AM to 10 AM PST
Session Title: Packaging and Co-packaged Optics
Dr. Bardia Pezeshki will give a talk on:
MicroLED array-based optical links using an imaging fiber for chip-to-chip communications
MAY 9 – MAY 12, 2022
MONTEREY, CA
Dr. Bardia Pezeshki will give a talk at CS MANTECH on:
Leveraging microLED display technology to solve the chip-to-chip data communication bottleneck
JUN 28 – JUN 29, 2022
BRUSSELS, BELGIUM
Session: Multiple markets for microLED’s
Jerome Veyret will present at CS INTERNATIONAL on LightBundleTM – mircoLED based optical interconnects with 10Tbps/mm2 @ < 0.5pJ/bit for chip-to-chip communications
FJ PER BIT
GBPS PER MM^2
GBPS PER MM
MAX LENGTH (CM)