Reinventing Chip-to-Chip Interconnects

Avicena’s LightBundle™ interconnects achieve 10x – 100x power and density improvements over any alternative for 1 cm – 10 meter reach.

The Challenge

High-performance compute and networking systems require increasingly distributed architectures but are limited by the shortcomings of conventional electrical and optical interconnects.

Avicena’s Solution

LightBundle™ interconnects provide < 0.5pJ/bit with > 4Tbps/mm² density for 1cm to 10m lengths, enabling vastly higher performance, more scalable systems.

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The Applications

HPC, AI/Machine Learning, disaggregated memory, composable disaggregated infrastructure.

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Avicena’s Technology by the Numbers…

100

FJ PER BIT

10000

GBPS PER MM^2

1000

GBPS PER MM

1000

MAX LENGTH (CM)

Reinventing Chip-to-Chip Interconnects

Reinventing Chip-to-Chip Interconnects

The Challenge

Avicena’s Solution

The Applications

Avicena’s Technology by the Numbers…

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