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September 13, 2021/in News, Press Releases /by LIMITL355_5KY

Avicena will showcase its multi-Tbps LED-based optical link for chip-to-chip communication at ECOC 2021 Highly parallel optical links with power efficiency of 0.1pJ/bit, and bandwidth density of 10Tbps/mm2 promise to smash current interconnect bottlenecks in distributed compute systems MOUNTAIN VIEW, CA and BORDEAUX, FRANCE — September 13, 2021 — Avicena Tech Corp., a privately held […]

LIGHTWAVE Online: June 17, 2021

June 17, 2021/in Articles, News /by LIMITL355_5KY

Avicena touts LED-based LightBundle optical interconnects for chip-to-chip communication The company’s LightBundle leverages microLED light sources and multicore fibers to create highly parallel interconnects that Avicena sources say can enable chip-to-chip communications at distances up to 10 m AUTHOR: Stephen Hardy Mountain View, CA, based startup Avicena Inc. has announced an optical interconnect based on […]

Press Release

September 13, 2021/in News, Press Releases /by LIMITL355_5KY

LIGHTWAVE Online: June 17, 2021

June 17, 2021/in Articles, News /by LIMITL355_5KY

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Press Release

September 13, 2021/in News, Press Releases /by LIMITL355_5KY

Avicena will showcase its multi-Tbps LED-based optical link for chip-to-chip communication at ECOC 2021

Highly parallel optical links with power efficiency of 0.1pJ/bit, and bandwidth density of 10Tbps/mm2 promise to smash current interconnect bottlenecks in distributed compute systems

MOUNTAIN VIEW, CA and BORDEAUX, FRANCE — September 13, 2021 — Avicena Tech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundle^TM multi-Tbps LED-based chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2021 in Bordeaux, France (https://www.ecocexhibition.com/).

The Avicena LightBundle^TM achieves order-of-magnitude improvements in power dissipation and density over any other interconnect technology up to a reach of 10 meters. LightBundle^TM is purpose-built for multi-Tbps chip-to-chip interconnects in distributed computing, processor-to-memory disaggregation, and other advanced computing applications. LightBundle^TM is based on arrays of novel GaN high-speed micro-emitters that leverage the microLED display manufacturing ecosystem and is fully compatible with high performance CMOS ICs.

Interconnects are becoming the key bottleneck in modern compute and network systems. Highly variable workloads are driving the evolution of densely interconnected, heterogeneous, software-defined clusters of CPUs, Graphical Processing Units (GPUs), Data Processing Units (DPUs) and shared memory blocks. Exploding Artificial Intelligence (AI) and Machine Learning (ML) workloads are exemplary of emerging applications driving an accelerating need for interconnects with extremely high density, low power consumption and low latency.

“The cloud and high-performance computing market is looking for a new class of energy efficient high bandwidth density interconnects,” said Vladimir Kozlov, Founder and CEO of LightCounting. “Avicena’s technology has the potential to deliver a paradigm shift in terms of power efficiency, bandwidth density, and reach.”

The cloud and high-performance computing market is looking for a new class of energy efficient high bandwidth density interconnects. Avicena’s technology has the potential to deliver a paradigm shift in terms of power efficiency, bandwidth density, and reach. — Vladimir Kozlov, Founder and CEO of LightCounting

LIGHTWAVE Online: June 17, 2021

June 17, 2021/in Articles, News /by LIMITL355_5KY

Avicena touts LED-based LightBundle optical interconnects for chip-to-chip communication

The company’s LightBundle leverages microLED light sources and multicore fibers to create highly parallel interconnects that Avicena sources say can enable chip-to-chip communications at distances up to 10 m

AUTHOR: Stephen Hardy

Mountain View, CA, based startup Avicena Inc. has announced an optical interconnect based on technology from the imagery and display worlds. The company’s LightBundle^TM leverages microLED light sources and multicore fibers to create highly parallel interconnects that Avicena sources say can enable chip-to-chip communications at distances up to 10 m.

At the heart of the LightBundle is the company’s Cavity-Reinforced Optical Micro-Emitters (CROMEs), based on GaN microLEDs, according to Chris Pfistner, who works in marketing and business development with Avicena. Such visible light emitters are commonly used in the display arena, but typically can transmit less than 1 Gbps of information. Avicena has developed a way to boost that output to approximately 10 Gbps, Pfistner says. The blue CROMEs are bonded to CMOS in a highly parallel array alongside arrays of silicon photodetectors grown directly in CMOS. The technology is capable of producing 10 Tbps per square millimeter at a power efficiency of less than 0.5 pJ/bit, Pfistner asserts. The CROME emitters can operate at ASIC temperatures, meaning they can serve reliably as internal laser sources for co-packaged optics without cooling.

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LIGHTWAVE Online: June 17, 2021

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LIGHTWAVE Online: June 17, 2021

Full Sized Blog Element (Big Preview Pic)

Press Release

Avicena will showcase its multi-Tbps LED-based optical link for chip-to-chip communication at ECOC 2021

Highly parallel optical links with power efficiency of 0.1pJ/bit, and bandwidth density of 10Tbps/mm2 promise to smash current interconnect bottlenecks in distributed compute systems

LIGHTWAVE Online: June 17, 2021

Avicena touts LED-based LightBundle optical interconnects for chip-to-chip communication

The company’s LightBundle leverages microLED light sources and multicore fibers to create highly parallel interconnects that Avicena sources say can enable chip-to-chip communications at distances up to 10 m

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