LED-based interconnects for chip-to-chip communications

LED-based interconnects for chip-to-chip communications

Avicena's LightBundle™ achieves 10x – 100x power and density improvements over any alternative for 1 cm – 10 meter reach.

Avicena's LightBundle™ achieves 10x – 100x power and density improvements over any alternative for 1 cm – 10 meter reach.

Value Proposition

THE CHALLENGE

High-performance compute and networking systems require increasingly distributed architectures but are limited by the shortcomings of conventional electrical and optical interconnects.

AVICENA’S SOLUTION

LightBundle™ interconnects provide <0.5pJ/bit with >10Tbps/mm² density for  1cm to 10m lengths, enabling vastly higher performance systems.

THE APPLICATIONS

HPC, AI/ML, Ethernet switches, disaggregated memory, composable disaggregated infrastructure, high bandwidth sensor interconnects.

Latest Press Release

Avicena’s XFAB ASICs with transferred LEDs in wafer-level testing.

Avicena Demonstrates Record-Breaking Ultra-Low-Energy Optical Chip-to-Chip Interconnect

Avicena partners with Lumileds to demonstrate microLED-based LightBundle™ chip-to-chip interconnects with superior energy efficiency and bandwidth density.

SAN DIEGO–(BUSINESS WIRE)–AvicenaTech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundle™ multi-Tbps chip-to-chip interconnect technology at the Optical Fiber Communications (OFC) Conference in San Diego, CA…

Read more on BusinessWire

LIGHTWAVE

Friday 5 video for March 11, 2022

Lightwave Editorial Director Stephen Hardy reveals his list of the Top 5 stories and themes for OFC 2022…

Connect with Avicena at Industry Events

SPIE Photonics West 2022

Conference on Next-Generation Optical Communication: Components, Sub-Systems and Systems

JAN 22 – JAN 27, 2022
SAN FRANCISCO, CA

Dr. Bardia Pezeshki will give an invited talk at SPIE Photonics West on:
Micro-LED-array based optical links using multi-core fiber for chip-to-chip communications

OFC 2022

MAR 6 – MAR 10, 2022
SAN DIEGO, CA
Booth #3351

Session Time: March 8, 2022 from 2 PM to 4 PM PST
Session Title: What are the Parallelization Technologies for Cost and Energy Efficient 1.6Tb Links?
Dr. Bardia Pezeshki will participate on the panel and give an invited talk on:
Dense Spatially Multiplexed-Lanes for Short Reach Optics Using Incoherent Optical Sources

Session Time: March 9, 2022 from 8 AM to 10 AM PST
Session Title: Packaging and Co-packaged Optics
Dr. Bardia Pezeshki will give an invited talk on:
MicroLED array-based optical links using an imaging fiber for chip-to-chip communications

Session Time: March 9, 2022 from noon to 2 PM PST
Session Title: OCP Panel: Beyond silicon photonics – New technologies for pluggable and co-packaged optics?
Dr. Chris Pfistner will participate in the OCP Luncheon and Panel followed by a Round Table Discussion

CS MANTECH 2022

MAY 9 – MAY 12, 2022
MONTEREY, CA

Dr. Bardia Pezeshki will give a talk at CS MANTECH on:
Leveraging microLED display technology to solve the chip-to-chip data communication bottleneck

CS INTERNATIONAL 2022

JUN 28 – JUN 29, 2022
BRUSSELS, BELGIUM

Session: Multiple markets for microLED’s
Alasdair Fikouras will present at CS INTERNATIONAL on LightBundleTM – microLED based optical interconnects with 10Tbps/mm2 @ < 0.5pJ/bit for chip-to-chip communications

ECOC 2022

SEP 18 – SEP 22, 2022
BASEL, SWITZERLAND

Visit Avicena at Stand #464.

ECOC 2021

SEP 12 – SEP 16, 2021
Stand # 916
BORDEAUX, FRANCE

Dr. Bardia Pezeshki will give a talk at ECOC on Wednesday, Sept 15th, 2021 @ 10:15 AM:
8x2Gb/s LED-Based Optical Link at 420nm for Chip-to-Chip Applications

Dr. Chris Pfistner will be speaking in the Market Focus Panel on Monday, Sept 13th, 2021 @ 1:55 PM:
Novel LED based parallel optical interconnects with 10Tbps/mm2 @ < 0.5pJ/bit for chip-to-chip communication

IMAPS 2021

OCT 12 – OCT 14, 2021
SAN DIEGO, CA

Dr. Bardia Pezeshki will give a talk at the Special Invited Session on Optical Co-Packaging on Wednesday, Oct. 13th, 2021 @ 1:00 PM.

OCP Summit 2021

NOV 8 – NOV 10, 2021
SAN JOSE, CA

Dr. Rob Kalman will be speaking at the Future Technology Session on Monday, Nov 8th, 2021:
Wide and parallel LED-based optical links using multi-core fiber for chip-to-chip communications

Dr. Bardia Pezeshki will be speaking in the Optical I/O and Chiplet Ecosystem Panel on Tuesday, Nov 9th, 2021:
LED based optical interconnects with 10Tbps/mm2 @ < 0.5pJ/bit for chip-to-chip communications