2025 PRESS RELEASES
Avicena Announces Series B Funding Round Led by Tiger Global with Participation from SK hynix
Amid unprecedented demand for ultra-low power optical interconnects in AI datacenters and future disaggregated memory fabrics, Avicena is preparing for the next phase of growth Sun
Avicena Works with TSMC to Enable PD Arrays for LightBundle™ MicroLED-Based Interconnects
Avicena is working with TSMC to optimize silicon photodetector (PD) arrays for Avicena’s LightBundle microLED-based interconnects aimed at AI scale-up networks with > 1Tbps/mm
Avicena Announces Modular LightBundle™ Optical Interconnect Platform with > 1Tbps/mm I/O density and < 1pJ/bit
Avicena is unveiling its modular LightBundle interconnect platform with industry-leading power efficiency and density based on microLEDs, aimed at AI scale-up networks San Francisc
2024 PRESS RELEASES
Avicena Appoints Former Oclaro CEO Greg Dougherty to its Board of Directors
Sunnyvale, California, USA — October 15, 2024 — Avicena, provider of advanced LED-based optical interconnects for computing, today announced the appointment of Greg Dougherty t
Avicena Demonstrates 30m Reach of microLED-based LightBundle Technology at European Conference on Optical Communications
Avicena is showcasing extended reach of 30 meters for its LightBundle Technology at ECOC 2024 in Frankfurt, Germany. Frankfurt, Germany — September 23, 2024 — Avicena, headquar
Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach
Avicena is unveiling a modular interconnect platform with multi-Tbps/mm shoreline density based on its LightBundle™ microLED technology, supporting a wide range of die-to-die int
2023 PRESS RELEASES
Avicena will showcase the world’s smallest 1Tbps optical transceiver at the SuperComputing Conference 2023 in Denver, CO
Avicena is showing the world’s smallest 1Tbps microLED-based transceiver using its LightBundle™ multi-terabit interconnect technology Sunnyvale, CA — November 14, 2023 — Av
Avicena demonstrates first microLED based Transceiver IC in 16nm finFET CMOS for chip-to-chip communications at ECOC 2023
Avicena is showing the first 1Tbps microLED-based Transceiver IC in 16nm finFET CMOS as part of its LightBundleTM multi-Terabit interconnect technology Sunnyvale, CA – and Glasgo
Avicena demonstrates hottest optical link at OFC 2023
Avicena is showing a record-breaking 235°C optical link using its LightBundle™ technology San Diego, CA — March 7, 2023 — Avicena, a privately held company headquartered in
Avicena partners with ams OSRAM to enable high-volume future production of ultra-low energy chip-to-chip interconnects
Avicena has signed a joint development agreement with ams OSRAM to develop key high-volume manufacturing capabilities for its LightBundle optical interconnects. San Diego, CA — M
2022 PRESS RELEASES
Avicena acquires microLED fab facility and engineering team from Nanosys
Avicena enhances its leadership position in microLED-based multi-Tbps chip-to-chip interconnects through the acquisition of a microLED fab facility and engineering team from Nanosy
Avicena demonstrates ultra-fast microLED-array based interconnects for chip-to-chip communications at ECOC 2022
Avicena is showing ultra-fast microLED links operating at 14Gbps per lane as part of its LightBundle™ multi-Terabit interconnect technology Mountain View, CA — and Basel, Switz
Avicena raises $25 Million in Series A to fund development of high capacity microLED-based optical interconnects
Samsung Catalyst Fund, Cerberus Capital Management, L.P., and Clear Ventures as well as strategic investor Micron Ventures participate in Series A to fast-track Avicena’s revolut
Avicena demonstrates record-breaking ultra-low-energy optical chip-to-chip interconnect
Avicena partners with Lumileds to demonstrate microLED-based LightBundle™ chip-to-chip interconnects with superior energy efficiency and bandwidth density SAN DIEGO, CA — March
2021 PRESS RELEASES
Avicena will showcase its multi-Tbps LED-based optical link for chip-to-chip communication at ECOC 2021
Highly parallel optical links with power efficiency of 0.1pJ/bit, and bandwidth density of 10Tbps/mm2 promise to smash current interconnect bottlenecks in distributed compute syste
Avicena unveils LightBundle™, a chip interconnect technology with dramatically lower power consumption and higher bandwidth density
Highly parallel optical links with power efficiency of 0.1pJ/bit, bandwidth density of 10Tbps/mm2 and reach of up to 10m promise to smash current interconnect bottlenecks in distri