2024 PRESS RELEASES
Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach
Avicena is unveiling a modular interconnect platform with multi-Tbps/mm shoreline density based on its LightBundle™ microLED technology, supporting a wide range of die-to-die int
2023 PRESS RELEASES
Avicena will showcase the world’s smallest 1Tbps optical transceiver at the SuperComputing Conference 2023 in Denver, CO
Avicena is showing the world’s smallest 1Tbps microLED-based transceiver using its LightBundle™ multi-terabit interconnect technology Sunnyvale, CA — November 14, 2023 — Av
Avicena demonstrates first microLED based Transceiver IC in 16nm finFET CMOS for chip-to-chip communications at ECOC 2023
Avicena is showing the first 1Tbps microLED-based Transceiver IC in 16nm finFET CMOS as part of its LightBundleTM multi-Terabit interconnect technology Sunnyvale, CA – and Glasgo
Avicena demonstrates hottest optical link at OFC 2023
Avicena is showing a record-breaking 235°C optical link using its LightBundle™ technology San Diego, CA — March 7, 2023 — Avicena, a privately held company headquartered in
Avicena partners with ams OSRAM to enable high-volume future production of ultra-low energy chip-to-chip interconnects
Avicena has signed a joint development agreement with ams OSRAM to develop key high-volume manufacturing capabilities for its LightBundle optical interconnects. San Diego, CA — M
2022 PRESS RELEASES
Avicena acquires microLED fab facility and engineering team from Nanosys
Avicena enhances its leadership position in microLED-based multi-Tbps chip-to-chip interconnects through the acquisition of a microLED fab facility and engineering team from Nanosy
Avicena demonstrates ultra-fast microLED-array based interconnects for chip-to-chip communications at ECOC 2022
Avicena is showing ultra-fast microLED links operating at 14Gbps per lane as part of its LightBundle™ multi-Terabit interconnect technology Mountain View, CA — and Basel, Switz
Avicena raises $25 Million in Series A to fund development of high capacity microLED-based optical interconnects
Samsung Catalyst Fund, Cerberus Capital Management, L.P., and Clear Ventures as well as strategic investor Micron Ventures participate in Series A to fast-track Avicena’s revolut
Avicena demonstrates record-breaking ultra-low-energy optical chip-to-chip interconnect
Avicena partners with Lumileds to demonstrate microLED-based LightBundle™ chip-to-chip interconnects with superior energy efficiency and bandwidth density SAN DIEGO, CA — March
2021 PRESS RELEASES
Avicena will showcase its multi-Tbps LED-based optical link for chip-to-chip communication at ECOC 2021
Highly parallel optical links with power efficiency of 0.1pJ/bit, and bandwidth density of 10Tbps/mm2 promise to smash current interconnect bottlenecks in distributed compute syste
Avicena unveils LightBundle™, a chip interconnect technology with dramatically lower power consumption and higher bandwidth density
Highly parallel optical links with power efficiency of 0.1pJ/bit, bandwidth density of 10Tbps/mm2 and reach of up to 10m promise to smash current interconnect bottlenecks in distri