Why is our technology important to the world?
Fundamental Power Challenge in ICT
ICT is projected to consume over 20% of the global energy by 2030. Interestingly, more than half the energy is not consumed in actual processing, but rather in moving data between different types of processors and memory. A large part of it is communication via copper connections where each wire must be powered to overcome resistance and capacitance for a connection to be established. Replacing these copper connections with efficient optical interconnects will drastically reduce the power consumed in ICT.
Learn more about how Avicena LightBundle™ technology can help solve the power challenge in ITC.
How does it relate to interconnect technology?
Avicena LightBundle™ Power and Density are >10x Better
The performance of an interconnect can be expressed in terms of a figure of merit (FoM) combining bandwidth density on the edge of chip (Gbps/mm) with energy efficiency (pJ/bit). This FoM is dependent on reach. As is the shown in the chart above our microLED based interconnects extend the performance of electrical links from a few mm up to about 10m thus allowing much more efficient disaggregation of high-performance compute (HPC) architectures.
How Does Our Technology Work?
LightBundle™ — Using microLEDs to “Move Data”
Avicena’s LightBundle™ interconnects use arrays of microLEDs connected via multi-core fiber bundles to Si Detectors on CMOS ICs. This enables ultra-low power links of < 1pJ/bit with up to 10m reach.
Want to learn even more about how Avicena LightBundle™ technology can revolutionize interconnects?
How Does Our Technology Compare?
General Interconnect Technology Comparison
