3-4 Oct, 2022
Signia by Hilton
SAN JOSE, CALIFORNIA, USA

TITLE: How Ecosystem enables the next level of innovation in HPC, HIT and Chiplets

ABSTRACT: HPC is a rapidly growing market segment driving significant innovation. AI accelerator, chiplets, heterogeneous integration technology and 2.5/3D packaging are core technologies that are transforming HPC applications. In the panel, we will share some perspectives on how the ecosystem can enable and accelerate the development of next generation HPC designs.

PANELISTS:
Charlie Wuischpard, CEO AYAR LABS
Bardia Pezeshki, CEO AVICENA
Art Swift, CEO ESPERANTO
Jonathan Ross, CEO GROQ
Ramin Shirani, CEO ETHERNOVIA
WooPoung Kim, Corp. EVP Head of Packaging Solutions Center (Samsung)