Press Releases
2025 Press Releases
Avicena Names Marco Chisari as New CEO
Amid unprecedented demand for ultra-low power optical interconnects in AI datacenters and future disaggregated memory fabrics, Avicena is poised for the next phase of growth Sunnyvale, CA, September 3, 2025 — Avicena, the leader in ultra-low power high-density microLED-based interconnects, announced today that Marco Chisari, former Executive Vice President, Head of Samsung Foundries an
Avicena Announces Series B Funding Round Led by Tiger Global with Participation from SK hynix
Amid unprecedented demand for ultra-low power optical interconnects in AI datacenters and future disaggregated memory fabrics, Avicena is preparing for the next phase of growth Sunnyvale, CA, May 14, 2025 — Avicena, the leader in ultra-low power high-density microLED-based interconnects, announced today it has raised $65M in Series B Funding, bringing the total capital raised […
Avicena Works with TSMC to Enable PD Arrays for LightBundle™ MicroLED-Based Interconnects
Avicena is working with TSMC to optimize silicon photodetector (PD) arrays for Avicena’s LightBundle microLED-based interconnects aimed at AI scale-up networks with > 1Tbps/mm I/O density and < 1pJ/bit efficiency. Sunnyvale, CA — April 22, 2025 —Avicena, headquartered in Sunnyvale, CA, announced today that the company will work with TSMC to optimize photodetector (PD) arrays
Avicena Announces Modular LightBundle™ Optical Interconnect Platform with > 1Tbps/mm I/O density and < 1pJ/bit
Avicena is unveiling its modular LightBundle interconnect platform with industry-leading power efficiency and density based on microLEDs, aimed at AI scale-up networks San Francisco, CA — March 31, 2025 — Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundleTM interconnect platform at OFC 2025 in San Francisco, CA (https://www.ofcconference.org/en-us/hom
2024 Press Releases
Avicena Appoints Former Oclaro CEO Greg Dougherty to its Board of Directors
Sunnyvale, California, USA — October 15, 2024 — Avicena, provider of advanced LED-based optical interconnects for computing, today announced the appointment of Greg Dougherty to its board of directors, effective immediately. Mr. Dougherty brings to the board a proven track record of executive leadership and extensive experience in the optical communications industry, along with stron
Avicena Demonstrates 30m Reach of microLED-based LightBundle Technology at European Conference on Optical Communications
Avicena is showcasing extended reach of 30 meters for its LightBundle Technology at ECOC 2024 in Frankfurt, Germany. Frankfurt, Germany — September 23, 2024 — Avicena, headquartered in Sunnyvale, CA, is showcasing the world’s first microLED-based 30 meter link at ECOC 2024 in Frankfurt, Germany (https://www.ecoc2024.org/), tripling the reach shown in its previous public demonstrati
Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach
Avicena is unveiling a modular interconnect platform with multi-Tbps/mm shoreline density based on its LightBundle™ microLED technology, supporting a wide range of die-to-die interfaces. San Diego, CA — March 25, 2024 — Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle chiplet interconnect at OFC 2024 in San Diego, CA (https://www.ofcconference.org
2023 Press Releases
Avicena will showcase the world’s smallest 1Tbps optical transceiver at the SuperComputing Conference 2023 in Denver, CO
Avicena is showing the world’s smallest 1Tbps microLED-based transceiver using its LightBundle™ multi-terabit interconnect technology Sunnyvale, CA — November 14, 2023 — Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating the world’s smallest 1Tbps optical transceiver as part its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the
Avicena demonstrates first microLED based Transceiver IC in 16nm finFET CMOS for chip-to-chip communications at ECOC 2023
Avicena is showing the first 1Tbps microLED-based Transceiver IC in 16nm finFET CMOS as part of its LightBundleTM multi-Terabit interconnect technology Sunnyvale, CA – and Glasgow, Scotland — October 2, 2023 — Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conferenc
Avicena demonstrates hottest optical link at OFC 2023
Avicena is showing a record-breaking 235°C optical link using its LightBundle™ technology San Diego, CA — March 7, 2023 — Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating the world’s hottest optical link operating at 235°C using its LightBundle™ communication architecture and technology at the Optical Fiber Communication Conference (OFC) 2023
Avicena partners with ams OSRAM to enable high-volume future production of ultra-low energy chip-to-chip interconnects
Avicena has signed a joint development agreement with ams OSRAM to develop key high-volume manufacturing capabilities for its LightBundle optical interconnects. San Diego, CA — March 6, 2023 — AvicenaTech Corp., a privately held company in Sunnyvale, CA, has partnered with ams OSRAM to develop high-volume manufacturing of GaN microLED arrays for its industry-leading LightBundle™ [&
2022 Press Releases
Avicena acquires microLED fab facility and engineering team from Nanosys
Avicena enhances its leadership position in microLED-based multi-Tbps chip-to-chip interconnects through the acquisition of a microLED fab facility and engineering team from Nanosys Mountain View, CA — October 18, 2022 — Avicena, the leader in high-performance microLED-based chip-to-chip interconnects, today announced that it has completed the acquisition of a microLED fabrication fa
Avicena demonstrates ultra-fast microLED-array based interconnects for chip-to-chip communications at ECOC 2022
Avicena is showing ultra-fast microLED links operating at 14Gbps per lane as part of its LightBundle™ multi-Terabit interconnect technology Mountain View, CA — and Basel, Switzerland — September 19, 2022 — Avicena, a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the European Conference for Optica
Avicena raises $25 Million in Series A to fund development of high capacity microLED-based optical interconnects
Samsung Catalyst Fund, Cerberus Capital Management, L.P., and Clear Ventures as well as strategic investor Micron Ventures participate in Series A to fast-track Avicena’s revolutionary interconnect technology MOUNTAIN VIEW, CA — August 2, 2022 — AvicenaTech Corp., the leader in microLED-based chip-to-chip interconnects, today announced that the company has secured $25M in Series A
Avicena demonstrates record-breaking ultra-low-energy optical chip-to-chip interconnect
Avicena partners with Lumileds to demonstrate microLED-based LightBundle™ chip-to-chip interconnects with superior energy efficiency and bandwidth density SAN DIEGO, CA — March 7, 2022 —AvicenaTech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the Optical Fiber Communication
2021 Press Releases
Avicena will showcase its multi-Tbps LED-based optical link for chip-to-chip communication at ECOC 2021
Highly parallel optical links with power efficiency of 0.1pJ/bit, and bandwidth density of 10Tbps/mm2 promise to smash current interconnect bottlenecks in distributed compute systems MOUNTAIN VIEW, CA and BORDEAUX, FRANCE — September 13, 2021 — Avicena Tech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundleTM multi-Tbps LED-based chip-to-
Avicena unveils LightBundle™, a chip interconnect technology with dramatically lower power consumption and higher bandwidth density
Highly parallel optical links with power efficiency of 0.1pJ/bit, bandwidth density of 10Tbps/mm2 and reach of up to 10m promise to smash current interconnect bottlenecks in distributed compute systems MOUNTAIN VIEW, CA — June 8, 2021 — Avicena Inc., a privately held company in Mountain View, CA, today unveils LightBundleTM, a highly parallel optical interconnect technology [&hell