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IEEE Spectrum

Two Startups are Bringing Fiber to the Processor

Avicena is featured in IEEE Spectrum for December 2022. While conventional Silicon Photonics provides a solution for medium to long reach communications, Avicena’s microLED technology enables ultra-low energy interconnects for short reach links ideally suited for chip-to-chip applications in HPC, AI/ML and memory disaggregation. To learn more, click the link below:

FEATURED PRESS RELEASES

Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach

March 25, 2024

Avicena will showcase the world’s smallest 1Tbps optical transceiver at the SuperComputing Conference 2023 in Denver, CO

November 14, 2023

2022 PRESS RELEASES

18 Oct

2022 Press Release

Avicena acquires microLED fab facility and engineering team from Nanosys

Avicena enhances its leadership position in microLED-based multi-Tbps chip-to-chip interconnects through the acquisition of a microLED fab facility and engineering team from Nanosy

19 Sep

2022 Press Release

Avicena demonstrates ultra-fast microLED-array based interconnects for chip-to-chip communications at ECOC 2022

Avicena is showing ultra-fast microLED links operating at 14Gbps per lane as part of its LightBundle™ multi-Terabit interconnect technology Mountain View, CA — and Basel, Switz

2 Aug

2022 Press Release

Avicena raises $25 Million in Series A to fund development of high capacity microLED-based optical interconnects

Samsung Catalyst Fund, Cerberus Capital Management, L.P., and Clear Ventures as well as strategic investor Micron Ventures participate in Series A to fast-track Avicena’s revolut

7 Mar

2022 Press Release

Avicena demonstrates record-breaking ultra-low-energy optical chip-to-chip interconnect

Avicena partners with Lumileds to demonstrate microLED-based LightBundle™ chip-to-chip interconnects with superior energy efficiency and bandwidth density SAN DIEGO, CA — March

2021 PRESS RELEASES

13 Sep

2021 Press Release

Avicena will showcase its multi-Tbps LED-based optical link for chip-to-chip communication at ECOC 2021

Highly parallel optical links with power efficiency of 0.1pJ/bit, and bandwidth density of 10Tbps/mm2 promise to smash current interconnect bottlenecks in distributed compute syste

8 Jun

2021 Press Release

Avicena unveils LightBundle™, a chip interconnect technology with dramatically lower power consumption and higher bandwidth density

Highly parallel optical links with power efficiency of 0.1pJ/bit, bandwidth density of 10Tbps/mm2 and reach of up to 10m promise to smash current interconnect bottlenecks in distri