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IEEE Spectrum

Two Startups are Bringing Fiber to the Processor

Avicena is featured in IEEE Spectrum for December 2022. While conventional Silicon Photonics provides a solution for medium to long reach communications, Avicena’s microLED technology enables ultra-low energy interconnects for short reach links ideally suited for chip-to-chip applications in HPC, AI/ML and memory disaggregation. To learn more, click the link below:

FEATURED PRESS RELEASES

Avicena demonstrates hottest optical link at OFC 2023

March 7, 2023

Avicena partners with ams OSRAM to enable high-volume future production of ultra-low energy chip-to-chip interconnects

March 6, 2023

2022 PRESS RELEASES

18 Oct

2022 Press Release

Avicena acquires microLED fab facility and engineering team from Nanosys

Avicena enhances its leadership position in microLED-based multi-Tbps chip-to-chip interconnects through the acquisition of a microLED fab facility and engineering team from Nanosy

19 Sep

2022 Press Release

Avicena demonstrates ultra-fast microLED-array based interconnects for chip-to-chip communications at ECOC 2022

Avicena is showing ultra-fast microLED links operating at 14Gbps per lane as part of its LightBundle™ multi-Terabit interconnect technology Mountain View, CA — and Basel, Switz

2 Aug

2022 Press Release

Avicena raises $25 Million in Series A to fund development of high capacity microLED-based optical interconnects

Samsung Catalyst Fund, Cerberus Capital Management, L.P., and Clear Ventures as well as strategic investor Micron Ventures participate in Series A to fast-track Avicena’s revolut

7 Mar

2022 Press Release

Avicena demonstrates record-breaking ultra-low-energy optical chip-to-chip interconnect

Avicena partners with Lumileds to demonstrate microLED-based LightBundle™ chip-to-chip interconnects with superior energy efficiency and bandwidth density SAN DIEGO, CA — March

2021 PRESS RELEASES

13 Sep

2021 Press Release

Avicena will showcase its multi-Tbps LED-based optical link for chip-to-chip communication at ECOC 2021

Highly parallel optical links with power efficiency of 0.1pJ/bit, and bandwidth density of 10Tbps/mm2 promise to smash current interconnect bottlenecks in distributed compute syste

8 Jun

2021 Press Release

Avicena unveils LightBundle™, a chip interconnect technology with dramatically lower power consumption and higher bandwidth density

Highly parallel optical links with power efficiency of 0.1pJ/bit, bandwidth density of 10Tbps/mm2 and reach of up to 10m promise to smash current interconnect bottlenecks in distri